Laminated semiconductor sensor with vibrating element
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 29, 1991
Grant Date -
N/A
app pub date -
May 30, 1989
filing date -
May 30, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electromechanical sensor is provided which comprises: a first silicon wafer which defines a resonant element; wherein the resonant element is doped with approximately the same impurity concentration as a background dopant concentration of the first wafer; and a second single crystal wafer which defines a device for coupling mechanical stress from the second wafer to the resonant element; wherein the first and second wafers are fusion bonded together.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully