Light emitting diode array with aligned solder bumps
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United States of America Patent
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-
Oct 22, 1991
Grant Date -
N/A
app pub date -
May 15, 1990
filing date -
Aug 11, 1988
priority date (Note) -
Expired
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Abstract
A close-spaced diode array in which connection to driver circuitry is enabled by application of a flip-chip solder bonding technique. Not only does this allow dense packing, high pixel content to be achieved but has concomitant advantages of increased light efficiency and improved heat sinking.
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