Self-bonding enamel solution for heat-resistant coatings

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United States of America Patent

PATENT NO 5059660
SERIAL NO

07521030

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Abstract

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Self-bonding enamel solutions contain A) from 5 to 80% by weight of a copolyamide composed of units which are derived from A.sub.1) organic dicarboxylic acids ##STR1## where R.sup.1 is an aliphatic radical of 1 to 20 carbon atoms or an aromatic radical of 5 to 25 carbon atoms, and A.sub.2) a mixture of diisocyanates, consisting of a.sub.21) from 20 to 95 mol % of a diisocyanate of the general formula OCN--R.sup.2 --NCO where R.sup.2 is an aromatic radical of 5 to 25 carbon atoms, a.sub.22) from 5 to 70 mol % of a diisocyanate of the general formula OCN--R.sup.3 --NCO where R.sup.3 is ##STR2## or a linear aliphatic radical of 3 to 30 carbon atoms which is substituted by 1 to 3 C.sub.1 -C.sub.4 -alkyl groups and R.sup.4 and R.sup.5 independently of one another are each C.sub.1 -C.sub.4 -alkyl or hydrogen, and a.sub.23) from 0 to 20 mol % of a diisocyanate of the general formula OCN--(CH.sub.2).sub.y --NCO where y is an integer of from 1 to 20, and B) from <0.5 to 30% by weight of a blocked di- or polyisocyanate in an organic solvent or solvent mixture.

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Patent OwnerAddress
ALTANA ELECTRICAL INSULATION GMBH46483 WESEL

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hoessel, Peter Schifferstadt, DE 14 76
Lehmann, Helmut Rheinbek, DE 15 101
Lienert, Klaus Hamburg, DE 6 118
Schupp, Hans Worms, DE 24 280

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