Composition which contains a polyphenylene ether resin and polyamide
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United States of America Patent
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Oct 22, 1991
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N/A
app pub date -
Dec 13, 1989
filing date -
Dec 13, 1988
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Expired
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Abstract
An improved thermoplastic resin composition is described, containing polyphenylene ether resin, polyamide resin, and certain organophosphorus compounds. Particular examples of the organophosphorus compounds are dimethyloxazolinylmethylbisvinylphenyl phosphate and bis(dimethyloxazolinylmethyl)vinylphenyl phosphate. The compositions are characterized by excellent mechanical properties and oil resistance.
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