Low stress polysilicon microstructures
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United States of America Patent
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Oct 22, 1991
Issued Date -
N/A
app pub date -
Mar 16, 1990
filing date -
Sep 28, 1988
priority date (Note) -
Expired
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Abstract
Method for relieving stress in silicon microstructures by forming a silicide on the microstructures. Sensors comprising a stress-relieved silicon microstructure are also described.
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