Heat-sealable laminated polyester film

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5059470
SERIAL NO

07550381

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Abstract

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A heat-sealable laminated film is disclosed which comprises a heat-sealing layer formed of a copolyester and having a thickness of not less than 5 .mu.m and a base layer formed of a copolyester containing the copolymerized unit common to the copolyester of the heat-sealing layer. The film of this invention excels in heat-sealing strength, is extensively usable in applications for packaging, electric insulation, and industry in general, and has high industrial value.

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Patent Owner(s)

Patent OwnerAddress
DIAFOIL COMPANY LIMITED3-2 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukuda, Yujiro New York, NY 16 261
Utsunomiya, Koji Nagahama, JP 1 30

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