Method of manufacturing continuous strip of electronic devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Oct 22, 1991
Issued Date -
N/A
app pub date -
Apr 17, 1990
filing date -
Dec 26, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of manufacturing a strip for carrying a plurality of small size electronic parts such as LED's enclosed hermetically in resin includes the formation of a grid-like conductor strip member by interconnecting lead wires for the electronic parts in a grid-like pattern. The conductor strip member is molded integrally with a strip segment in which the plurality of electronic parts are mutually connected by a runner member. A connecting portion is formed integrally at least at one end of the strip segment at a predetermined position such that while connecting the connecting portion of a first plastic strip segment with one end of a second plastic strip segment, wherein the predetermined position of the connecting portion is such that the distance between the preassigned mount locations for the small size electronic devices positioned on both sides of the connecting portion coincides with the predetermined pitch. While connecting together continuously a number of the strip segments by means of the connecting portions through repetitive cycles of molding operation, the electronic part carrying strip of any desired length up to a semi-endless length can be manufactured.
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