Molded circuit component unit for connecting lead wires

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5057650
SERIAL NO

07561567

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A molded circuit component for connecting to lead wires includes body and a protective cover. The body includes a partition wall area having a plurality of housing grooves, partition walls, body notches, positioning projections and fastening pin reception apertures. The protective cover includes a plurality of cover notches, recesses and fastening pins to correspond respectively with the body notches, positioning projections and fastening pin reception apertures. Metal lines having connection terminals on their ends are embedded in the housing grooves. Lead wires are positioned in the grooves so that the conductors of the lead wires are placed on, and attached to, the connection terminals. The protective cover is then attached to the body.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD1006 OAZA KADOMA KADOMA-SHI OSAKA 571-8501
SUMITOMO ELECTRIC INDUSTRIES LTD5-33 KITAHAMA 4-CHOME CHUO-KU OSAKA-SHI OSAKA 5410041 ?5410041
SANKYO KASEI CO LTD11-14 KUGAHARA 2-CHOME OTA-KU TOKYO 146-0085

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hatase, Hiroshi Osaka, JP 4 50
Kanno, Tooru Tokyo, JP 3 75
Kawasaki, Syusaku Osaka, JP 1 34
Kojima, Keiichi Kanagawa, JP 19 205
Matsuda, Tatsuo Tochigi, JP 29 177
Saen, Haruo Tochigi, JP 14 187
Saito, Katsuya Osaka, JP 10 76
Sugawara, Kiyoto Tochigi, JP 4 81
Urushibata, Kenichi Tochigi, JP 7 98
Yoshizawa, Norio Tokyo, JP 5 60
Yumoto, Tetsuo Tokyo, JP 14 122

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