Junction inspection method and apparatus for electronic parts
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United States of America Patent
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Oct 1, 1991
Grant Date -
N/A
app pub date -
Aug 29, 1989
filing date -
Aug 29, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A plurality of lead wires such as those from an IC (an integrated circuit) is irradiated by a fan beam at same time. Infrared rays radiated from the portion which is irradiated by the fan beam and the periphery of the portion are detected so as to catch a thermogram exhibiting the temperature distribution. The thermogram is processed by image processing so as to produce a temperature distribution image. This image is visually compared with a standard temperature distribution-pattern on a display apparatus to judge whether soldering on those lead wires is defective or not.
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