Apparatus for the treatment of articles by high velocity impacting thereof with a particulate abrasive material
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United States of America Patent
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Oct 1, 1991
Issued Date -
N/A
app pub date -
Aug 10, 1989
filing date -
Aug 10, 1989
priority date (Note) -
Expired
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Abstract
A method is provided for soldering using tin-containing solder to substrate surfaces that are gold plated wherein a selected portion of the gold plated surface is treated by impacting with a high velocity stream of fine nickel containing abrasive particles to remove all the gold from the treated surface and then effecting joining to the treated surface by conventional soldering techniques.
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