Method of making rigid-flexible multilayer board system
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United States of America Patent
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-
Sep 17, 1991
Issued Date -
N/A
app pub date -
Apr 6, 1990
filing date -
Aug 28, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Mounting only electronic parts on a printed circuit board puts a limit on the mounting density. According to the invention, electronic parts are mounted on a flexible board. This flexible board is then mounted on a printed circuit board to thereby increase the mounting density.
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