Apparatus for cooling circuits
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United States of America Patent
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Aug 20, 1991
Grant Date -
N/A
app pub date -
Apr 19, 1990
filing date -
Apr 19, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus for cooling circuit modules by use of a thermo-electric device which comprises a series of semiconductor regions and etched copper conductors designed to conduct heat in a specified direction by means of the Peltier Effect. The thermo-electric device is sandwiched between two layers of a polymer based, thermally conductive dielectric such as the dielectric used in the manufacture of Thermal Clad.TM.. The hot layer of Thermal Clad.TM. (i.e., the layer that receives heat) is laminated directly to a heat sink. The cold layer of Thermal Clad.TM. is laminated directly to a cold plate which is, in turn, coupled to the circuit module.
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