Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
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United States of America Patent
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Jul 16, 1991
Grant Date -
N/A
app pub date -
Aug 16, 1989
filing date -
Aug 19, 1988
priority date (Note) -
Expired
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Abstract
The present invention is characterized in that, in a ball wedge bonding using a fine bonding wire precoated with a thin insulating layer, ultrasonic vibration is applied to a capillary to effect the delivery of the wire smoothly during movement of the capillary to a second bonding point while delivering the wire after ball bonding at a first bonding point.
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