High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip
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United States of America Patent
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Jul 2, 1991
Grant Date -
N/A
app pub date -
Jul 3, 1989
filing date -
Jul 3, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A hermetic, high current package for a semiconductor device includes wide flat leads which are bonded to the contact pads of the device and formed to extend through apertures in an insulating lid. The lid is sealed to a base and the apertures around the leads are sealed with solder to provide the hermetic package. This package limits lateral current flow in the contact pads of the semiconductor device to relatively low levels which ensure the integrity of the contact pads.
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