Adducts of an hydroxy-free acrylate resin and an epoxy resin
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United States of America Patent
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Jun 25, 1991
Grant Date -
N/A
app pub date -
May 23, 1989
filing date -
May 23, 1989
priority date (Note) -
Expired
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Abstract
This invention provides an adduct of an epoxy resin and a hydroxy free acrylate resin. The novel adduct contains vinyl unsaturation and hence may be copolymerized with an ethylenically unsaturated monomer to provide a tough thermoset resin.
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