Hot-bonding silicone adhesive composition
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United States of America Patent
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Jun 25, 1991
Grant Date -
N/A
app pub date -
Jun 26, 1989
filing date -
Jun 29, 1988
priority date (Note) -
Expired
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Abstract
Hot-bonding silicone adhesive composition prepared by kneading and heating a mixture of a polydiorganosiloxane and a microparticulate silica and then adding an arbitrary amount of a solvent and an organopolysiloxane resin to the kneaded and heated mixture. The composition has substantially no tack at room temperature when freed of its solvent; however, it has high adhesive strength at elevated temperature.
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