Thermally conductive adhesive
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United States of America Patent
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Jun 25, 1991
Grant Date -
N/A
app pub date -
May 7, 1990
filing date -
May 7, 1990
priority date (Note) -
Expired
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Abstract
Adhesive resins are filled with carbon fibers that have a three-dimensional structure. The fibers have variable lengths and widths. The fiber filled adhesive exhibits high thermal conductivity values. Electronic systems having components bonded by a layer of these adhesives resins have high through-the-thickness thermal conductivity.
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