Slicing machine and control method thereof

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United States of America Patent

PATENT NO 5025593
SERIAL NO

07297473

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Abstract

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A slicing machine of this invention includes a blade having a cutting edge for slicing a silicon ingot, a tension disk for rotatably supporting the blade, a drive motor for rotating the blade, a deformation detection mechanism for detecting a deformation amount of the blade, and a control unit responsive to the measured deformation for correcting the relative position between the support base and the blade. A control method of the slicing machine is also disclosed.

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Patent Owner(s)

  • TOYO ADVANCED TECHNOLOGIES CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hamasaki, Tatsumi Hiroshima, JP 7 72
Kawaguchi, Keishi Higashihiroshima, JP 5 58
Tadera, Yoshihiro Kure, JP 5 58
Yamazaki, Sachio Hiroshima, JP 1 19

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