Polyamide resin-metal laminate
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United States of America Patent
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Jun 18, 1991
Grant Date -
N/A
app pub date -
Sep 19, 1989
filing date -
Mar 22, 1988
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Expired
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Abstract
A polyamide resin-metal laminate comprising a metal substrate having a heat-treated epoxy resin coating layer on its surface and a polyamide resin laminated on the coating layer of the substrate, said coating layer having the following surface analytical spectrum values as measured by electron spectroscopy for chemical analysis (ESCA method): (1) Relative elemental content of carbon element (C.sub.1s spectrum): at least 50 atomic %, (2) Relative contents based on the total content of C.dbd.O, C--O, C.dbd.C--C.dbd.C, CH and C--C functional groups of C.sub.1s spectrum, as determined by the respective waveform analyses: C.dbd.O group: at least 4.0 atomic %, and C--O group: at most 25 atomic %.
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