Method for preparing a substrate surface for bonding with a synthetic resin by applying a layer by sand blasting
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United States of America Patent
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Jun 18, 1991
Grant Date -
N/A
app pub date -
Jan 24, 1989
filing date -
Jan 25, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to a method for preparing a surface for bonding with a synthetic resin. In the method, a layer is applied onto a substrate surface by sand blasting with a composition comprising (A) 0.01 to 90% by weight of an optionally silanized material having a particle size less than 5 .mu.m and having a hardness greater than that of the substrate surface, and/or (B) 20 to 100% by weight of a silanized siliceous material having an average particle size of 2 to 200 .mu.m, and (C) the remainder of the sand blasting composition having an average particle size greater than 5 .mu.m, and optionally the layer is thereafter silanized. The invention is further directed to the above-mentioned composition.
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