Method of producing a tape for providing electronic modules, and tape obtained by this method
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United States of America Patent
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Jun 11, 1991
Grant Date -
N/A
app pub date -
Jun 6, 1988
filing date -
Jun 22, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention concerns a method of mass producing a tape intended to provide electrical circuits, the tape constituting an intermediate step in the production of electronic modules. The method comprises providing a metal strip (1) having openings defining a series of similar networks of conductors, each conductors being connected to the strip (1) by a bridge, and providing insulating sheets (18) having holes (19, . . . 27) and sticking these sheets to the metal strip in such a manner that the holes face the conductors. The thus-assembled strip (1) and sheets (18) constitute the tape, while the conductors with a part of the sheets define the circuits of the modules.
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