Shock wave particle removal method and apparatus
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United States of America Patent
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Jun 11, 1991
Grant Date -
N/A
app pub date -
Jan 22, 1990
filing date -
Jan 22, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus and method using laser induced shock waves to dislodge particles from a wafer surface. The apparatus includes a wafer support, a particle detector and computer for locating and storing the locations of particles on the wafer, a laser, and focusing optics. Laser beam pulses are directed toward the wafer surface at a shallow angle or with a large beam convergence angle to avoid damage to the wafer.
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