Method for injection molding into a resonating mold

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United States of America Patent

PATENT NO 5017311
SERIAL NO

07381054

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Abstract

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An injection molding method in which a molding material is injected into a cavity formed in a mold to be molded. The mold is driven to resonate so that resonance occurs in the mold at n wavelengths, where n=m/2 and m is a positive integer, and an injection molding apparatus provided with a fixed mold and a movable mold; the movable mold having a cavity in one side thereof, and an ultrasonic vibration feed device being connected to the other side thereof.

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Patent Owner(s)

Patent OwnerAddress
IDEMITSU KOSAN CO LTD 1-1 3-CHOME MARUNOUCHI CHIYODA-KU TOKYO JAPANNot Provided
SEIDENSHA ELECTRONICS CO LTD 9-13 2-CHOME TORIGOE TAITO-KU TOKYO JAPANNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Furusawa, Toshihiro Sodegaura, JP 16 264
Matsugishi, Noriaki Tokyo, JP 6 105
Nakajima, Takashi Tokyo, JP 196 2283
Satoh, Atsushi Sodegaura, JP 38 798

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