Molded article with partial metal plating and a process for producing such article
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United States of America Patent
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May 14, 1991
Issued Date -
N/A
app pub date -
Oct 16, 1989
filing date -
Nov 18, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
This invention relates to a partially plated molded article and to a process for the production of a molded article which is partially plated with metal such as circuit boards, connectors, decorative articles, etc., where a catalyst such as palladium, gold, etc. is added after roughening of the surface of a primary molded article, and then, the molded article is inserted into the mold and a secondary article molded thereabout so that the portions to be plated with metal are exposed, and after such molding, the exposed portions are plated with metal. Alternatively, the catalyst may be applied after molding of the secondary article around the roughened primary molded article.
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