Film forming method and film forming device

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United States of America Patent

PATENT NO 5015330
SERIAL NO

07486416

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Abstract

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A film forming method comprises the steps of placing a plurality of objects to be processed and supplying an etching gas in a reaction container, removing a natural oxidization originated film on an object to be processed placed in the reaction container under a heating condition by plasma etching, exhausting the etching gas after stopping supply of the etching gas so as to stop making of the plasma, and supplying a film forming gas in the reaction container without rendering the reaction container open to air so as to form a film on the objects.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED A CORP OF JAPAN1-26-2 NISHI-SHINJUKU SHINJUKU-KU TOKYO
KABUSHIKI KAISHA TOSHIBA A CORP OF JAPAN72 HORIKAWA-CHO SAIWAI-KU KAWASAKI-SHI
TOKYO ELECTRON SAGAMI LIMITED A CORP OF JAPAN1-2-41 MACHIYA SHIROYAMA-MACHI TSUKUI-GUN KANAGAWA 220-01

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kumagai, Yoshio Kofu, JP 8 271
Miyazaki, Shinji Yokohama, JP 62 1159
Moriya, Takahiko Yokohama, JP 16 949
Okumura, Katsuya Yokohama, JP 337 7835
Tanaka, Susumu Hachioji, JP 119 1328

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