Substrates with dense metal vias produced as co-sintered and porous back-filled vias
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 30, 1991
Issued Date -
N/A
app pub date -
Mar 6, 1989
filing date -
May 22, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Dense metal vias in pure alumina substrates are derived from a metallization composition having 80-97% refractory metal, 2-15% alumina, 0.05-5% sintering aid, and 0-5% bonding additive; it has been found that for alumina contents greater than about 12%, a bonding additive is not required. The same compositions, absent the sintering aid, can be used to form bimetallic vias; these vias include a porous metal network where the pores are infiltrated with another metal, for example, porous tungsten infiltrated with copper.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully