Joining of ceramic components to metal components
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United States of America Patent
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Apr 23, 1991
Grant Date -
N/A
app pub date -
Jul 25, 1989
filing date -
Jul 28, 1988
priority date (Note) -
Expired
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Abstract
The invention provides a method of joining together a ceramic component and a metal component. According to the invention a surface of the ceramic component is metallized with a metallizing metal to form a metallized layer thereon. The metal component is then thermocompression bonded to the metallized layer, optionally after the metallized layer is plated with a continuous metal layer. For electrochemical cell applications, the ceramic component is typically alpha-alumina, the metal of the metallized layer is typically selected from tantalum, titanium, vanadium, tungsten and molybdenum, and the metal component typically comprises, in metallic or alloy form, at least one of iron, nickel, cobalt, chromium, manganese or copper.
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