Lead type chip capacitor and process for producing the same
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United States of America Patent
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Apr 9, 1991
Grant Date -
N/A
app pub date -
Jul 25, 1989
filing date -
Jul 26, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A lead type chip capacitor which is disclosed herein comprises a capacitor chip having a lead terminal bonded thereto through a joining or bonding layer made of a highly melting metal paste. The lead type chip capacitor is produced by bonding at least one internal electrode in a capacitor chip with a lead terminal by a metal paste, drying them at a temperature in a range of 100.degree. to 200.degree. C., and firing the resulting capacitor chip with the lead terminal bonded thereto at a temperature in a range of 500.degree. to 900.degree. C. in the air or in a nitrogen atmosphere.
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