Method and apparatus for improving thermal coupling between a cooling plate of a semiconductor package housing and a heat sink
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United States of America Patent
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-
Mar 19, 1991
Issued Date -
N/A
app pub date -
Aug 7, 1989
filing date -
Oct 21, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor component package comprises a metal plate and a synthetic resin housing or body. The plate is formed with an aperture by which it can be secured to a heat sink, generally a metal plate. Around the aperture is a weakened annular portion produced by shearing. When the package housing is secured to a surface which is not completely flat, mechanical stressing due to the tightening of the screw coupling is limited to the weakened annular portion and is not transmitted to the resin housing and to the elements therein.
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