Product in tape form for supporting and conveying electronic components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Mar 19, 1991
Grant Date -
N/A
app pub date -
Oct 19, 1988
filing date -
Oct 22, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The produce comprises an electrically conductive tape cut out or etched so as to form windows from which connecting tabs for a chip project, according to the 'single-layer' T.A.B. technology. An adhesive tape is glued to the conductive tape and pierced with windows centered on and lying within the conductive tape's windows. According to the invention, apertures isolate the connecting tabs for the purpose of applying test signals to the chip by means of the tabs then carried by the adhesive tape alone. The invention is used for testing integrated power circuits.
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