Dispersion strengthened metal composites
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United States of America Patent
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Mar 12, 1991
Issued Date -
N/A
app pub date -
Jun 17, 1988
filing date -
Dec 13, 1983
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Abstract
There is provided a substantially fully dense powdered metal composite comprising a highly conductive metal or metal alloy matrix having dispersed therein discrete microparticles of a refractory metal oxide and discrete macroparticles of a mechanical or physical property-conferring additive material. The respective components undergo minimal alloying or interdispersion because sintering is not utilized in forming the composite. These composites are characterized by high thermal or electrical conductivity and a desired property (controlled thermal expansion, high strength, wear and arc erosion resistance, or magnetic) attributable to the composite forming material, like refractory metal, alloy, or compound. The composites are useful in forming lead frames for integrated circuit chips, electric lamp lead wires, electrical contact members, and discrete component leads.
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