Bond signature analyzer
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United States of America Patent
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Mar 12, 1991
Grant Date -
N/A
app pub date -
Dec 22, 1989
filing date -
Dec 22, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A feedback signal of an ultrasonic generator (13) employed in a ball bonder (11) is sampled by an analog-to-digital converter (23) under control of a microprocessor (25) to provide a 'bond signature' indicative of bond quality. The microprocessor (25) then compares the bond signature to limits representing a good quality bond to provide an indication of a good or failed bond. The indication may be visually provided by projecting the bond signature and limits on a display (27), as well as automatically provided by a programmed comparison.
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