Process for the preparation of aminoplastic resins having very low formaldehyde emission rates
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United States of America Patent
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Mar 5, 1991
Grant Date -
N/A
app pub date -
Dec 23, 1988
filing date -
Dec 23, 1987
priority date (Note) -
Expired
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Abstract
The preparation of aminoplastic resins containing melamine, having very low rates of formaldehyde emission, and being particularly useful for the production of particle boards. In a second stage of the process for preparing the resin, additional NH.sub.2 (melamine and urea) is added to a conventional condensate solution at an increased pH between 6 and 9 so as to lower the F/NH.sub.2 molar ratio to between 0.5 and 0.9. Urea is added in a third stage to obtain an F/NH.sub.2 of between 0.30 and 0.50, with the optional addition of borax.
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