Method for improving adherence of copper foil to resinous substrates
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United States of America Patent
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Mar 5, 1991
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N/A
app pub date -
Nov 29, 1989
filing date -
Jul 10, 1989
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Abstract
The present invention comprises an improvement in the surface treatment of copper surfaces. It produces a strong and stable bond, resistant to chemical attack and to thermal and mechanical stresses between said copper foil surfaces and adjacent surfaces of resinous layers. It is especially useful in multilayer printed circuit fabrication and in the treatment of copper circuit lines and areas which are disconnected from each other, that is, which do not have electrically conductive continuity. In a method according to the invention, an oxidized cooper surface is reduced in the presence of a polymer addition agent, and the partially reduced surface is then exposed to a nonoxidizing reagent. The result is a reticulated metallic copper microstructure capable of forming a strong adhesive bond with a resinous substrate, and having a high resistance to thermal, mechanical, and chemical (e.g. acid) stress.
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