High speed tin, lead or tin/lead alloy electroplating
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United States of America Patent
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Feb 19, 1991
Issued Date -
N/A
app pub date -
Sep 20, 1989
filing date -
Dec 9, 1988
priority date (Note) -
Expired
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Abstract
An electrolyte, system and process for depositing tin, lead or tin/lead alloys upon a substrate by high speed electroplating, which includes a basis solution of an alkyl or alkylol sulfonic acid; and at least one of a solution soluble tin compound or a solution soluble lead compound; and an alkylene oxide condensation compound of (1) an aliphatic hydrocarbon having seven, preferably six or less, carbon atoms and at least one hydroxy group, or (2) an organic compound having no more than a total of twenty carbon atoms in one or two independent or joined rings optionally substituted with an alkyl moeity of less than six carbon atoms.
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