Bonding pad scheme
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United States of America Patent
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-
Feb 5, 1991
Grant Date -
N/A
app pub date -
Dec 18, 1987
filing date -
Dec 18, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A technique is disclosed for manufacturing an integrated circuit die which is capable of being packaged in any of two or more different package types having different arrangements of bonding posts. The circuit is laid out with redundant pads located at different places on the die so that one pad in each pair of redundant pads is accessible for bonding with posts in one package type, while the other pad in each pair of redundant pads is accessible for bonding with posts in another package type. Illustrative layouts are shown whereby various types of pads, e.g., power pads, signal input pads, signal output pads and bidirectional I/O pads, may be made redundant.
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