Method of liquid phase diffusion bonding of metal bodies
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 29, 1991
Issued Date -
N/A
app pub date -
Sep 5, 1989
filing date -
Feb 10, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Insert 1 comprises thin substrate made by cold-rolling, and two bonding alloy layers formed by plating on the upper and lower surfaces of substrate, respectively. Both layers is extremely thin, and is made of an alloy having a melting point lower than that of substrate. Insert 1 is used to achieve liquid phase diffusion bonding of first and second base metals. Insert 1 is interposed between first base metal and second base metal. Then, insert 1 and base metals are clamped together with a pressure of, for example, 0.5 kgf/mm.sup.2, and are placed in a atmosphere of a low pressure of about 10.sup.-4 Torr and heated to the melting point of alloy layers or to a temperature above this melting point but below the melting points of substrate and plates.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully