Moisture-curable hot-melt adhesive composition

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United States of America Patent

PATENT NO 4985535
SERIAL NO

07435723

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Abstract

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A moisture-curable hot-melt adhesive composition comprising a reaction product obtainable by reacting (A) a mixture of (a) a high molecular weight thermoplastic polyester component predominantly composed of a hydroxy-terminated high molecular weight polyester containing a hydrocarbon chain with a molecular weight of 600 to 6,000 and having a molecular weight of 8,000 to 25,000 and (b) a low molecular weight polyol having a molecular weight of not more than 5,000 with (B) a polyisocyanate compound in an NCO/OH ratio of 1.4 through 3. This moisture-curable hot-melt adhesive composition is useful for the adhesion at a low temperature, and shows an excellent heat resistance and initial physical properties.

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Patent Owner(s)

Patent OwnerAddress
SUNSTAR ENGINEERING INCNO 3 FAN 1 ASAHI STREET OSAKA PREFECTURE JAPAN TAKATSUKI-SHI OSAKA

International Classification(s)

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  • 1989 Application Filing Year
  • C08G Class
  • 1244 Applications Filed
  • 12 Patents Issued To-Date
  • 0.97 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances198919901991199219931994199519960255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sugimori, Masaru Takatsuki, JP 10 155
Takada, Masaharu Osaka, JP 22 214

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  • 41 Citation Count
  • C08G Class
  • 0 % this patent is cited more than
  • 34 Age
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