Fine polishing composition for wafers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 8, 1991
Grant Date -
N/A
app pub date -
Dec 29, 1988
filing date -
Dec 29, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A fine polishing composition for wafers, comprising water, particulate amorphous silica and a polysaccharide polymer graft-polymerized with acrylamide alone or together with at least one vinyl monomer selected from the group consisting of acrylic acid, methacrylic acid and styrenesulfonic acid, and adjusted with an alkaline substance to a pH of from 8 to 12.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully