Method of manufacturing a plastic encapsulated semiconductor device with insulated heat sink
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United States of America Patent
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Jan 1, 1991
Issued Date -
N/A
app pub date -
Feb 1, 1990
filing date -
Jan 25, 1983
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor device has a lead frame. The lead frame has a mount portion and a lead portion. A semiconductor chip is mounted on one major surface of the mount portion of the lead frame. The semiconductor chip is connected by an electrical connecting means to the lead portion of the lead frame. An electrical insulating layer is formed on the other major surface of the mount portion of the lead frame. The mount portion, part of the lead portion of the lead frame, the semiconductor chip and the electrically connecting means, excluding the surface of the electrical insulating layer of the mount portion of the lead frame, are sealed or encapsulated by an electrical insulating member.
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