Cutting apparatus for processing elongated vegetable products and the like

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4981073
SERIAL NO

07388529

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A cluster cutter apparatus and a snipping apparatus are similarly formed to increase the snipping efficiency of a bean processing line. Each apparatus includes a rotating drum having a circumferential slotted surface in combination with an internally elongated inclined orienting plate unit for orienting of the beans onto the lower interior periphery of the rotating drum. The plate unit may be an inclined fixed plate or a rotating paddle wheel and includes a plurality of plates which is located in the lower leading quadrant of the drum. The paddle wheel is rotated at an appropriate speed relative to the drum and contributes to a highly cost effective high volume bean processing system. The plate(s) supports the beans and provides gradual and controlled vertical transfer to the drum slots. The cluster cutter includes separating disc units to separate the clusters. A plurality of separate bean severing knife units are spaced circumferentially over the complete lower half of the drum between the two o'clock and nine o'clock positions on the drum.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
LYCO MANUFACTURING P O BOX 31 115 COMMERCIAL DR COLUMBUS WI 53925 A CORP OF WIWI

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Zittel, David R Columbus, WI 74 1405

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