Moulding compositions comprised of semirigid, fatty acid copolyamides, elastomers and optionally conventional polyamides
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United States of America Patent
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Dec 11, 1990
Issued Date -
N/A
app pub date -
Jun 8, 1987
filing date -
Sep 6, 1982
priority date (Note) -
Expired
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Abstract
Polyamide-based molding compositions having enhanced flexibility and resilience, especially at low temperatures, are prepared from (1) semirigid copolyamides prepared from fatty acid dimers, (2) elastomers containing moieties compatible or reactive with such copolyamides (1) and comprising olefinic copolymers bearing carboxyl and/or carboxylate groups, copolyester-amides, polyurethanes, organopolysiloxane and polyurethane block copolymers, and copolymers produced from a latex which comprises suitable functional groups, and, optionally, (3) conventional polyamides.
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