Test probe assembly for testing integrated circuit devices
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United States of America Patent
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-
Dec 4, 1990
Grant Date -
N/A
app pub date -
Dec 18, 1989
filing date -
Dec 18, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A test probe assembly for testing an integrated circuit (IC) device having contact pads deployed in a predetermined pattern in a common plane. The assembly includes a contactor formed by a flexible film of dielectric material having a rectangular planar central zone from whose corners extend radial slots to define suspension quadrants. Probe contacts formed on the undersurface of the central zone in a matching pattern are connected to probe terminals on the margins of the quadrants. The quadrants are marginally supported on corresponding branches of a mounting frame whereby the central zone sags below the frame which surrounds a central port in a printed circuit board, the port exposing the central zone to the IC device to be tested.
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