Solder sealed bandpass filter and method of making
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United States of America Patent
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-
Nov 13, 1990
Grant Date -
N/A
app pub date -
Apr 3, 1989
filing date -
Apr 3, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The fabrication and structure of a hermetically sealed, environmentally-sensitive, thin film coating between two planar transmitting substrates is disclosed. The edges of the substrates are metallized to allow solder to wet and form a vapor barrier. Two such substrates are assembled with an O-ring spacer or an epoxy/glue spacer and the assembly is then soldered to a protective ring using a benign low temperature indium based solder. Fluxes from the soldering step are separated from the coating by the O-ring spacer, which also acts as an aperture stop.
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