Method for uniting workpieces of silicon-infiltrated silicon carbide with large dimensions in a materially bonded manner and apparatus for performing the method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 13, 1990
Grant Date -
N/A
app pub date -
Jun 21, 1989
filing date -
Jun 28, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and apparatus for uniting workpieces of silicon-infiltrated silicon carbide with large dimensions includes surrounding each of two silicon-infiltrated silicon carbide workpieces with at least one tightly closing shell in the vicinity of a junction between the workpieces, defining at least one intermediate space between the shell and the workpieces. A vacuum or an inert gas atmosphere is maintained in the intermediate space or spaces. Solder is placed at the junction and the junction is locally heated to soldering temperature for materially bonding the workpieces by soldering at the junction.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully