Hermetic microminiature packages
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United States of America Patent
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-
Oct 30, 1990
Grant Date -
N/A
app pub date -
May 4, 1988
filing date -
May 4, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A hermetic tape package and a process for forming the hermetic tape package are disclosed. The package is capable of high lead densities and occupies a minimum of space. A test frame is incorporated into the package to permit testing of an electronic device prior to sealing the package.
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