Thin oriented polymer films containing metal-organic compounds

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United States of America Patent

PATENT NO 4963429
SERIAL NO

07291546

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Very thin polymer/MOC film, on the order of 500A to 1000A thick, is prepared by dissolving both the polymer and the MOC sequentially in the same solvent to obtain an emulsion consisting of a discontinuous phase of finite globules of the MOC solution dispersed in a continuous phase of the polymer solution, then partially evaporating the solvent from a layer of the emulsion, and finally subjecting the resultant polymer/MOC layer, while the solvent continues to evaporate, to a controlled treatment permitting attainment of a desired arrangement of the MOC phase in and throughout the film, depending on the specific film properties sought to be achieved, while the polymer crystallizes. The treatment may be a drawing operation or, if the metal component of the MOC is magnetic, the application of a magnetic field either parallel or perpendicular to the plane of the layer. Such films are useful as dielectrics for capacitors and may further be useful as shielding materials for integrated circuits to protect the same against electromagnetic interference, as data storage devices, and as electromagnetic wavelength selectors. Film of greater thickness can be formed by winding or folding the starting film up to the thickness of several thousand layers.

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Patent Owner(s)

Patent OwnerAddress
WEA MANUFACTURING INC A CORP OF DE210 NORTH VALLEY AVENUE OLYPHANT PA 18447

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Norian, Karl H Center Valley, PA 1 13
Rieck, Ulrich Elmshorn/Kolln-Reisiek, DE 2 34

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