Printed wiring board substrate for surface mounted components

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4963425
SERIAL NO

06708588

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A laminated printed wiring board having surfaces thereof fabricated from conventional fiber reinforced laminates which are secured together by means of an adhesive fabricated of a reinforced thermosetting resin having a coefficient of thermal expansion (CTE) which is substantially smaller than the CTE of the surface laminate whereby the apparent CTE of the overall printed wiring board assembly is substantially controlled.

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Patent Owner(s)

Patent OwnerAddress
L-3 COMMUNICATIONS CORPORATION600 THIRD AVENUE NEW YORK NY 10016

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abramowitz, Jay S Salt Lake City, UT 1 15
Buchanan, Alan M Midvale, UT 4 292
Flygare, Roberta A Y Salt Lake City, UT 1 15

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