Surface mount machine with lead coplanarity verifier
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United States of America Patent
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Oct 2, 1990
Grant Date -
N/A
app pub date -
May 22, 1990
filing date -
May 22, 1990
priority date (Note) -
Expired
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Abstract
Apparatus for performing a non-contact three-dimensional inspection of a surface-mount component prior to placement on a printed circuit board. Specifically, an arrangement to ensure acceptable alignment (i.e. coplanarity) of all component heads in the XZ or YZ plane, where XY is the plane of the component. The apparatus is embodied within a conventional pick and place machine and performs critical, in-process, lead coplanarity inspection.
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