Semiconductor wafer array with electrically conductive compliant material
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United States of America Patent
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Sep 4, 1990
Issued Date -
N/A
app pub date -
Oct 28, 1987
filing date -
Jul 17, 1986
priority date (Note) -
Expired
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Abstract
A semiconductor wafer array comprising a plurality of wafers of semiconductor material. Each of the wafers is provided with cone-shaped or pyramid-shaped vias. Inserted in each of the vias is a correspondingly shaped wad of electrically conductive compliant material for forming continuous vertical electrical connections between the wafers in the stack. The base of each wad makes connection to a bonding pad on the surface of a lower wafer as well as to the electrically conductive compliant material in the lower wafer.
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